Date of Award
Electrical and Computer Engineering
Raju, G. R. Govinda,
Engineering, Electronics and Electrical.
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This study investigates the dielectric strength of various polymers at different temperatures. The results achieved are interpreted in terms of probabilities of failures to allow validation of dielectric strength values where they can be safely used in a field application. We have used the Weibull distribution as the analysis technique in conjunction with a computer program developed to calculate the scale and shape parameters with confidence limits for this distribution. The experimental setup used provides a controlled test environment for the subject materials minimizing the variation in external factors and also reducing the duration of time required in duplicating and varying test conditions as desired in our investigation. We have chosen to study thin film polymer materials namely, Polytetrafluoroethylene (PTFE) with 50 mum thickness, Kapton with 125 mum thickness and Nomex-Polyester-Nomex, with 150 mum thickness, due to the increase in demand and popularity for application in industrial uses for these materials. (Abstract shortened by UMI.) Source: Masters Abstracts International, Volume: 40-03, page: 0755. Adviser: G. R. Govinda Raju. Thesis (M.A.Sc.)--University of Windsor (Canada), 2001.
Jafri, Syed Zaki, "Experimental investigaton of dielectric strength of polymer films." (2001). Electronic Theses and Dissertations. 2025.