Date of Award
Physics, Condensed Matter.
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Multilayered Cu/Ni thin films were grown epitaxially on copper substrate using electrodeposition method. The multilayers possess coherent interfaces with well-defined satellites surrounding the main Bragg peaks in the X-Ray diffractograms. Hardness values greater than those of the constituent materials, by a factor of two or better, were found. Also, a Hall-Petch type relationship between hardness and superlattice periodicity, that is, hardness is in proportion to the inverse of the square root of the superlattice periodicity, is determined for superlattice periodicity in the range of about 40 to 80 angstroms. When nickel thickness is fixed at about 50 angstroms, hardness is independent of copper thickness for the range of from 16 to 32 angstroms. On the other hand, hardness drops when nickel thickness increases from about 17 to 41 angstroms while copper thickness is fixed at about 10 angstroms. Source: Masters Abstracts International, Volume: 39-02, page: 0520. Adviser: M. Schlesinger. Thesis (M.Sc.)--University of Windsor (Canada), 1999.
Zhaojiang, Li., "Hardness characteristics in electrodeposited copper/nickel multilayer systems." (1999). Electronic Theses and Dissertations. 2269.