Date of Award
Electrical and Computer Engineering
Adhesive Wafer Bonded, BCB, CMUT, Coupling coefficient, Dielectric charging, Ophthalmic
Creative Commons License
This work is licensed under a Creative Commons Attribution-Noncommercial-No Derivative Works 4.0 License.
This dissertation presents the design methodology, fabrication procedure, and key experimental characterization results of a linear array of capacitive micromachined ultrasonic transducers (CMUT) for possible ophthalmic anterior segment imaging application. The design methodology involves analytical, 3-D electromechanical finite element analysis, and Verasonics Vantage 128 ultrasonic research platform based diagnostic imaging simulations to develop a technique that minimizes electrical charging and center frequency drift while improving the transduction efficiency. In the design, Bisbenzocyclobutene (BCB), a low K polymer from Dow Chemical Company, has been innovatively used for the first time to fabricate the structural layer of the CMUT diaphragm, realize the interelectrode dielectric spacer, and to act as a low temperature adhesive bonding agent. Additionally, the top CMUT electrode has been placed at the bottom of the diaphragm to affect higher capacitance change that increases sensitivity and provides additional decoupling of the electrical charging effects. Several arrays with element count ranging from 8 to 128 elements and a center frequency range of 5 MHz to 40 MHz have been designed and fabricated. Due to an unforeseen adhesion issue during wirebonding, a 32 channel 40 MHz CMUT array has been packaged manually to validate the fabrication process and CMUT operation. Extensive SEM inspections of the CMUT cross-sections show good agreement with the design specifications. Static and dynamic measurements using a Polytec laser Doppler vibrometer, impedance measurement using an Agilent vector network analyzer, and LCR measurement results are in excellent agreement with analytical and FEA analysis using IntelliSuite. The frequency analysis exhibits high electromechanical coupling coefficient of 0.66 at a low bias voltage of 20 V and high uniformity. A successful measurement of the lower drift of the center frequency 0.32% and higher coupling coefficient verifies the hypothesis that the excellent electrical, structural, and processing characteristics of BCB is a viable option to mitigate the dielectric charging and improve the transduction efficiency of CMUTs.
Manwar, Rayyan, "A BCB Diaphragm Based Adhesive Wafer Bonded CMUT Probe for Biomedical Application" (2017). Electronic Theses and Dissertations. 5996.