Plasticizing Shellac for Biodegradable, Flexible Electronics
Standing
Undergraduate
Type of Proposal
Oral Research Presentation
Faculty
Faculty of Science
Faculty Sponsor
Dr. Tricia Carmichael
Proposal
This research project is regarding the examination of thin films made from shellac that contain varying amounts of added polyethylene glycol (PEG) as a plasticizing component to soften the material, permitting its use in flexible thin-film electronic devices. Currently, a large amount of these devices include polyethylene terephthalate (PET) plastics. However, PET plastics are extremely harmful to the environment and they are non-biodegradable. By utilizing an everyday solution, shellac, the environmental problems with PET can be solved. In spite of that, the largest problem with shellac is that in its nature state is extremely brittle, making it unable to be used for flexible electronics. This problem can be solved by introducing an environmentally friendly plasticizing component into the shellac resin, such as PEG. The use of PEG will enable flexible shellac substrates to be used in thin film electronics, decreasing the amount of PET plastic waste while also having a smaller impact on the environment. The quality of these substrates were evaluated using optical microscopy, atomic force microscopy, contact angle goniometry, UV/vis spectroscopy, and infrared spectroscopy. Overall, the results of this project could bring the world one step closer to a future where sustainable flexible electronics are a household item.
Availability
Open Availability
Special Considerations
The presenter will be Lindsay Lesperance-Nantau.
Plasticizing Shellac for Biodegradable, Flexible Electronics
This research project is regarding the examination of thin films made from shellac that contain varying amounts of added polyethylene glycol (PEG) as a plasticizing component to soften the material, permitting its use in flexible thin-film electronic devices. Currently, a large amount of these devices include polyethylene terephthalate (PET) plastics. However, PET plastics are extremely harmful to the environment and they are non-biodegradable. By utilizing an everyday solution, shellac, the environmental problems with PET can be solved. In spite of that, the largest problem with shellac is that in its nature state is extremely brittle, making it unable to be used for flexible electronics. This problem can be solved by introducing an environmentally friendly plasticizing component into the shellac resin, such as PEG. The use of PEG will enable flexible shellac substrates to be used in thin film electronics, decreasing the amount of PET plastic waste while also having a smaller impact on the environment. The quality of these substrates were evaluated using optical microscopy, atomic force microscopy, contact angle goniometry, UV/vis spectroscopy, and infrared spectroscopy. Overall, the results of this project could bring the world one step closer to a future where sustainable flexible electronics are a household item.